Very soft finishing sponge for sparing and even application of sealing products such as 1K-Nano or Lack-Polish grün P1.01. Only 23 mm high ensures lower deforming forces, very comfortable operation and the highest stability. The mesh (foam) structure and appropriate porosity make it easier to keep clean. Milled edges increase the flexibility of the polishing pad, which allows it to better adapt to the shape of the polished object. The color of the material matched to the polish increases the safety of the processes.
Hardness: 4. Abrasion resistance 2.
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GPSR
expand_moreProducer:
KOCH CHEMIE
Koch‑Chemie GmbH
Einsteinstr. 42, D-59423 Unna
info@koch-chemie.com
Person responsible for the product:
Liquid Master Dominik Kolecek
ul. Lubliniecka 44, 42-772 Łagiewniki Małe
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